Loctite 638 Equivalent Maximum Strength Green Retaining Compounds
from Shirley(hengying@cnhybond.com 0086-18927302778 Skype:hengying11)
1:Product Description
HYBOND 638 provides the following product characteristics:
Technology: Acrylic
Chemical Type: Urethane methacrylate
Appearance (uncured): Green liquidLMS
MComponents: One component - requires no mixing
Viscosity: high
Cure : Anaerobic
Secondary Cure: Activator
Application :Retaining
Strength: high
HYBOND 638™ is designed for the bonding of cylindrical fitting parts, particularly where bond gaps can approach 0.25 mm and where maximum strength at room temperature is required. The product cures when confined in the absence of air between close fitting metal surfaces and prevents loosening
and leakage from shock and vibration. Typical applications include locking bushings and sleeves into housings and onshafts.
2: Typical Properties of uncured material
Specific Gravity @ 25 °C 1.09
Flash Point - See MSDS
Viscosity, Brookfield - RVT, 25 °C, mPa·s (cP):
Spindle 3, speed 20 rpm 2,000 to 3,000LMS
Viscosity, EN 12092 - MV, 25 °C, after 180 s, mPa·s (cP):
Shear rate 129 s-1 1,500 to 3,000
3:Typical Properties of cured material
Physical Properties
Coefficient of Thermal Expansion,
ISO 11359-2, K-1
80×10-6
Coefficient of Thermal Conductivity,
W/(m·K)
0.1
Specific Heat, kJ/(kg·K) 0.3
4:Typical Performance of Cured Material
Adhesive Properties
After 24 hours @ 22 °C
Compressive Shear Strength, ISO 10123:
Steel pins and collars N/mm² ≥25LMS
(psi) (3,625)
After 15 minutes @ 22 °C
Compressive Shear Strength, ISO 10123:
Steel pins and collars N/mm² ≥13.5LMS
(psi) (1,960
5:For Assembly
(1). For best results, clean all surfaces (external and internal) with a HYBOND cleaning solvent and allow to dry.
(2). If the material is an inactive metal or the cure speed is too slow, spray with Activator 7649™ and allow to dry.
(3). For Slip Fitted Assemblies, apply adhesive around the leading edge of the pin and the inside of the collar and use a rotating motion during assembly to ensure good coverage.
(4). For Press Fitted Assemblies, apply adhesive thoroughly to both bond surfaces and assemble at high press onrates.
(5). For Shrink Fitted Assemblies the adhesive should be coated onto the pin, the collar should then be heated to create sufficient clearance for free assembly.
(6). Parts should not be disturbed until sufficient handling
strength is achieved
6:For Disassembly
Apply localized heat to the assembly to approximately
250 °C. Disassemble while hot.
7:For Clean up
1. Cured product can be removed with a combination of soaking in a HENG YING solvent and mechanical abrasion such as a wire brush.
8:Storage
Store product in the unopened container in a dry location. Storage information may be indicated on the product container labeling.
Optimal Storage: 8 °C to 21 °C. Storage below 8 °C or greater than 28 °C can adversely affect product properties. Material removed from containers may be contaminated during use. Do not return product to the original container.HYBOND Corporation cannot assume responsibility for product which
has been contaminated or stored under conditions other than those previously indicated. If additional information is required, please contact us.
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